SMT component cleaning process Solutions
In order to ensure the high reliability, electrical performance stability, and service life of PCBA, improve the appearance quality and yield of PCBA, avoid pollution of pollutants and the resulting electro migration, electrochemical corrosion, and circuit failure. It is necessary to clean the solder paste residue, flux residue, oil stains, dust, and solder pad oxide layer, fingerprints, organic pollutants, and particles after the PCBA welding process.